Heat and Control will present Tek-Dry thermal processing technology at PACK EXPO International for the first time, alongside water recirculation, seasoning and packaging systems for potato processors.

The exhibition takes place at McCormick Place in Chicago on October 18–21, 2026. Heat and Control will exhibit at booth N-4706, with a showcase that also includes its partners Ishida and CEIA.

According to the company, the recently acquired Tek-Dry technology brand expands its integrated processing portfolio with systems designed for high-throughput French fry and snack drying. The range includes drying, toasting, roasting and cooling equipment for French fries, snacks and other food applications.

Water management will be another focus. Heat and Control will present Cascade Water Recirculation systems, which it says reduce freshwater consumption in potato processing lines.

Its Symphony Seasoning systems cover both in-kitchen and on-machine applications. The company says the technology minimises fugitive dust and reduces operators’ exposure to irritants during seasoning application.

The showcase will also include new formats in integrated vertical form-fill-seal snack food packaging.

Heat and Control said its team would discuss equipment integration for new products, production expansions and upgrades to existing lines, including projects aimed at improving operating efficiency.