Urschel Cutting Technology at interpack 2023

Visit Urschel at interpack 2023, Hall 1, Booth C34, to see the latest in food-cutting technology. Explore the new laser-cut CC Slicer frame with a bold, improved design for increased sanitation and flexibility.
“See the sleek TranSlicer 2520 Cutter, designed for expedited sanitation (IP69K), ideal for leafy greens, celery, or leek. Also on display, is the Affinity Integra Dicer designed to take on traditionally hard-to-process applications. Discover the Comitrol Processor 3600 Slant for the optimal milling of a wide array of ingredients. Successful processors partner with Urschel to deliver intelligent cutting solutions,” according to a recent company release.
Around 2,700 key players and newcomers from all over the world are using interpack from 4 to 10 May as a stage to present their premières and celebrate the long-awaited reunion of the global packaging industry.














